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Statistical analysis of current-voltage characteristics in Au/Ta_2O_5/n-GaN Schottky barrier heterojunction using different methods

机译:不同方法AU / TA_2O_5 / N-GaN肖特基障碍异质结的电流 - 电压特性统计分析

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摘要

We report on the influence of incorporation of Ta_2O_5 thin film at the interface of Au/GaN by means of e-beam evaporation technique. The fabricated Au/Ta_2O_5/n-GaN MIS junctions have been analysed using Ⅰ-Ⅴ measurements and were extended to a voltage range of ±20 V. The Schottky diode parameters for instance Φ_(bo), n and R_S values are evaluated using Ⅰ-Ⅴ curves at room temperature. The statistical distribution analysis provides the mean 'Φ_(bo)' value of 0.85 eV with deviation of 0.00181 eV and mean value from 'n' is 1.36 with a normal deviation of 0.00562. Two important electrical parameters such as R_S and R_(sh) values are also extracted from Ⅰ-Ⅴ characteristics. Furthermore, Cheung, Norde, modified Norde, Hernandez and Chattopadhyay methods are used to evaluate the Schottky barrier parameters from I-V data. The comparison is made between the extracted electrical parameters such as n, Φ_(bo) and R_S from Ⅰ-Ⅴ characteristics of Au/Ta_2O_5/n-GaN MIS junctions and are in well agreement with each other. Under forward-bias, the fabricated Au/Ta_2O_5/n-GaN MIS junction conduction mechanisms such as ohmic and SCL were found to be dominant at lower and higher voltage regimes, respectively. By fitting reverse-bias region of Ⅰ-Ⅴ curves, PF conduction mechanism was found to be dominant at the interfaces of Au/Ta_2O_5/n-GaN. In conclusion, the obtained superior rectification ratio of 6.06 × 10~4 and higher SBH of 0.87 eV was ascribed to the purposefully deposited undoped GaN buffer layer between epitaxial GaN and sapphire substrate.
机译:通过电子束蒸发技术,我们报告了Au / GaN界面在Au / GaN界面中的影响。已经使用Ⅰ-ⅴ测量分析了制造的AU / TA_2O_5 / N-GaN MIS连接,并延伸到±20V的电压范围。使用Ⅰ评估φ_(BO),N和R_S值的肖特基二极管参数 - 在室温下曲线。统计分布分析提供了0.85eV的平均“φ_(Bo)值,其偏差为0.00181eV,平均值为1.36,正常偏差为0.00562。还提取了两个重要的电气参数,例如R_S和R_(SH)值,从Ⅰ-n特性提取。此外,Cheung,Norde,Modified Norde,Hernandez和Chattopadhyay方法用于评估I-V数据的肖特基势垒参数。在提取的电气参数之间进行比较,例如N,φ_(BO)和来自Ⅰ-β特性的N,φ_(BO)和R_S的R_S,彼此相一致。在前偏压下,发现制造的AU / TA_2O_5 / N-GAN MIS结传导机构,例如欧姆和SCL,分别在较低和更高的电压调节处占主导地位。通过拟合Ⅰ-β曲线的反向偏置区域,发现PF传导机制在AU / TA_2O_5 / N-GaN的界面处占主导地位。总之,所获得的优异的整流比为6.06×10〜4,较高的0.87eV的较高的SBH被归因于外延GaN和蓝宝石衬底之间的故意沉积的未掺杂的GaN缓冲层。

著录项

  • 来源
    《Applied Physics》 |2021年第1期|46.1-46.12|共12页
  • 作者单位

    Department of Physics Sri Padmavati Mahila Visvavidyalayam Tirupati Andhra Pradesh 517502 India;

    Department of Physics Madanapalle Institute of Technology and Science Madanapalle Andhra Pradesh 517325 India;

    Department of Mechanical Engineering Madanapalle Institute of Technology & Science Madanapalle Andhra Pradesh 517325 India;

    Department of Chemistry Madanapalle Institute of Technology and Science Madanapalle Andhra Pradesh 517325 India;

    Department of Physics Rajeev Gandhi Memorial College of Engineering and Technology Nandyal 518501 Andhra Pradesh India;

    Department of Electronic Science Kurukshetra University Kurukshetra 136119 India;

    Department of Electronic Science Kurukshetra University Kurukshetra 136119 India;

    Department of Physics Sri Krishnadevaraya University Anantapur Andhra Pradesh India;

    School of Chemical Engineering Yeungnam University Gyeongsan 38541 Republic of Korea;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Ideality factor; Ta_2O_5 interfacial layer; Series/shunt resistance; Gallium nitride; Schottky barrier height;

    机译:理想因素;Ta_2O_5界面层;系列/分流抗性;氮化镓;肖特基障碍高度;

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