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Nitrogen incorporation characteristics on a 4H-SiC epitaxial layer

机译:4H-SiC外延层上的氮掺入特性

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摘要

The N incorporation characteristics on a 4H-SiC epitaxial layer were reinvestigated. It was found that the desorption process and thermally activated process are aspects of the N incorporation mechanism of 4H-SiC to which attention should be paid. This mechanism depends on both the rate-limiting condition and lattice polarity. The N desorption process dominates the N incorporation of the Si-face under the C-supply-limiting condition and that of the C-face without recourse to the rate-limiting condition. On the other hand, the thermally activated process dominates only the N incorporation of the Si-face under the Si-supply-limiting condition. The site-competition phenomenon was also found to depend on the rate-limiting condition.
机译:对4H-SiC外延层上的N掺入特性进行了重新研究。发现解吸过程和热活化过程是4H-SiC氮掺入机理的一部分,应引起重视。该机制取决于速率限制条件和晶格极性。 N脱附过程在C供给限制条件下主导了Si面的N结合,而在不依赖速率限制条件的情况下主导了C面的N结合。另一方面,在Si供给限制条件下,热活化过程仅支配Si面的N结合。还发现现场竞争现象取决于限速条件。

著录项

  • 来源
    《Applied Physics Letters》 |2006年第2期|p.021907.1-021907.3|共3页
  • 作者单位

    Power Electronics Research Center, National Institute of Advanced Industrial Science and Technology, Central 2, 1-1-1 Umezono, Tsukuba, Ibaraki 305-8568, Japan;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 应用物理学;计量学;
  • 关键词

  • 入库时间 2022-08-18 03:21:41

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