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Lower current operation of phase change memory cell with a thin TiO_2 layer

机译:具有薄TiO_2层的相变存储单元的低电流操作

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The phase change memory cell with 8 nm TiO_2 layer inserted between phase change material Ge_2Sb_2Te_5 and bottom heating electrode tungsten was fabricated. It showed an advanced electrical threshold switching characteristics in the dc current-voltage measurement with the much lower value of threshold voltage of 1.5 V. The reset current of the device cell decreased 68% compared with that without TiO_2 layer. These results will contribute to the lower power consumption of the phase change memory. Besides that, the device cell showed good endurance characteristics, demonstrating the capability of random access memory application.
机译:制造了在相变材料Ge_2Sb_2Te_5和底部加热电极钨之间插入8 nm TiO_2层的相变存储单元。它在直流电流-电压测量中显示出先进的电阈值开关特性,其阈值电压值低得多,为1.5V。与没有TiO_2层的器件相比,器件单元的复位电流降低了68%。这些结果将有助于降低相变存储器的功耗。除此之外,该设备单元还具有良好的耐久性,证明了随机存取存储器应用的能力。

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