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机译:使用自由基暴露的低温锗与硅直接晶圆键合
Tyndall National Institute, University College Cork, Lee Makings, Cork, Ireland;
Tyndall National Institute, University College Cork, Lee Makings, Cork, Ireland;
Environmental Research Institute, University College Cork, Cork, Ireland;
Tyndall National Institute, University College Cork, Lee Makings, Cork, Ireland Department of Chemistry, University College Cork, Cork, Ireland;
Department of Material Science and Engineering, UCLA, California 90095, USA;
Tyndall National Institute, University College Cork, Lee Makings, Cork, Ireland;
机译:基于溅射非晶Ge的低温无氧化物硅和锗晶片键合
机译:低温直接晶片键合和层剥落法制备的锗/硅p-n结的特性
机译:绝缘体上硅衬底上的低温In-to-Si直接晶片键合的高效垂直除气通道
机译:低温晶圆键合:等离子辅助硅直接键合与硅金共晶键合
机译:低温下基于氧化硅的表面的纳米键合:通过分子动力学和键合表面形貌,亲和力和自由能表征的键合相模型
机译:低温晶片直接键合的电容式微机械超声换能器的制备与表征
机译:使用自由基暴露的低温锗与硅直接晶圆键合