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Hysteresis phenomena of the two dimensional electron gas density in lattice-matched InAIN/GaN heterostructures

机译:晶格匹配的InAIN / GaN异质结构中二维电子气密度的磁滞现象

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摘要

High-temperature transport properties in high-mobility lattice-matched InAIN/GaN heterostructures have been investigated. An interesting hysteresis phenomenon of the two dimensional electron gas (2DEG) density is observed in the temperature-dependent Hall measurements. After high-temperature thermal cycles treatment, the reduction of the 2DEG density is observed, which is more serious in thinner InAIN barrier samples. This reduction can then be recovered by light illumination. We attribute these behaviors to the shallow trap states with energy level above the Fermi level in the GaN buffer layer. The electrons in the 2DEG are thermal-excited when temperature is increased and then trapped by these shallow trap states in the buffer layer, resulting in the reduction and hysteresis phenomenon of their density. Three trap states are observed in the GaN buffer layer and C_(Ga) may be one of the candidates responsible for the observed behaviors. Our results provide an alternative approach to assess the quality of InAIN/GaN heterostructures for applications in high-temperature electronic devices.
机译:研究了高迁移率晶格匹配的InAIN / GaN异质结构中的高温传输性能。在与温度相关的霍尔测量中,观察到了二维电子气(2DEG)密度的一个有趣的磁滞现象。经过高温热循环处理后,观察到2DEG密度的降低,这在较薄的InAIN势垒样品中更为严重。然后可以通过光照恢复该减少。我们将这些行为归因于GaN缓冲层中的能级高于费米能级的浅陷阱态。当温度升高时,2DEG中的电子被热激发,然后被这些浅陷阱态俘获到缓冲层中,从而导致其密度减小和出现滞后现象。在GaN缓冲层中观察到三个陷阱态,C_(Ga)可能是导致观察到的行为的候选者之一。我们的结果提供了另一种方法来评估用于高温电子设备的InAIN / GaN异质结构的质量。

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  • 来源
    《Applied Physics Letters》 |2015年第5期|052102.1-052102.4|共4页
  • 作者单位

    State Key Laboratory of Artificial Microstructure and Mesoscopic Physics, School of Physics, Peking University, Beijing 100871, China;

    State Key Laboratory of Artificial Microstructure and Mesoscopic Physics, School of Physics, Peking University, Beijing 100871, China;

    State Key Laboratory of Artificial Microstructure and Mesoscopic Physics, School of Physics, Peking University, Beijing 100871, China;

    Engineering Research Center for Semiconductor Integrated Technology, Institute of Semiconductors, Chinese Academy of Sciences, P. O. Box 912, Beijing 100083, China;

    Engineering Research Center for Semiconductor Integrated Technology, Institute of Semiconductors, Chinese Academy of Sciences, P. O. Box 912, Beijing 100083, China;

    State Key Laboratory of Artificial Microstructure and Mesoscopic Physics, School of Physics, Peking University, Beijing 100871, China;

    State Key Laboratory of Artificial Microstructure and Mesoscopic Physics, School of Physics, Peking University, Beijing 100871, China;

    State Key Laboratory of Artificial Microstructure and Mesoscopic Physics, School of Physics, Peking University, Beijing 100871, China;

    State Key Laboratory of Artificial Microstructure and Mesoscopic Physics, School of Physics, Peking University, Beijing 100871, China;

    Institute of Microelectronics, Peking University, Beijing 100871, China;

    State Key Laboratory of Artificial Microstructure and Mesoscopic Physics, School of Physics, Peking University, Beijing 100871, China;

    State Key Laboratory of Artificial Microstructure and Mesoscopic Physics, School of Physics, Peking University, Beijing 100871, China;

    State Key Laboratory of Artificial Microstructure and Mesoscopic Physics, School of Physics, Peking University, Beijing 100871, China,Collaborative Innovation Center of Quantum Matter, Beijing 100871, China;

    Department of Physics, Tsinghua University, Beijing 100084, China;

    State Key Laboratory of Artificial Microstructure and Mesoscopic Physics, School of Physics, Peking University, Beijing 100871, China,Collaborative Innovation Center of Quantum Matter, Beijing 100871, China;

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