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Low Noise Amplifier With Integrated Balanced Antenna for 60 GHz Wireless Communications

机译:具有集成平衡天线的低噪声放大器,用于60 GHz无线通信

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The implementation of a dipole antenna co-designed and monolithically integrated with a low noise amplifier (LNA) on low resistivity Si substrate (20 $Omegacdot{rm cm}$ ) manufactured in 0.35 $mu{rm m}$ commercial SiGe HBT process with ${rm f}_{rm T}/{rm f}_{max}$ of 170 GHz and 250 GHz is investigated theoretically and experimentally. An air gap is introduced between the chip and a reflective ground plane, leading to substantial improvements in efficiency and gain. Moreover, conjugate matching conditions between the antenna and the LNA are exploited, enhancing power transfer between without any additional matching circuit. A prototype is fabricated and tested to validate the performance. The measured 10-dB gain of the standalone LNA is centered at 58 GHz with a die size of 0.7 mm $times$ 0.6 mm including all pads. The simulated results showed antenna directivity of 5.1 dBi with efficiency higher than 70%. After optimization, the co-designed LNA-Antenna chip with a die size of 3 mm $times$ 2.8 mm was characterized in anechoic chamber environment. A maximum gain of higher than 12 dB was obtained.
机译:共同设计并与低噪声放大器(LNA)在低电阻率Si衬底(20Ωcm)上单芯片集成的偶极子天线的实现,该衬底以0.35μm{rm m} $的商业SiGe HBT工艺制造,采用理论上和实验上研究了170 GHz和250 GHz的$ {rm f} _ {rm T} / {rm f} _ {max} $。在芯片和反射接地层之间引入了气隙,从而大大提高了效率和增益。此外,还利用了天线与LNA之间的共轭匹配条件,无需任何额外的匹配电路即可增强之间的功率传输。制造并测试原型以验证性能。独立LNA的测量10 dB增益以58 GHz为中心,管芯尺寸为0.7 mm x 0.6 mm,包括所有焊盘。仿真结果表明,天线方向性为5.1 dBi,效率高于70%。经过优化,共同设计的LNA-Antenna芯片在无回声室环境中的特征是裸片大小为3mm x 2.8mm。获得了高于12 dB的最大增益。

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