Chip-on-chip technology is a low-cost alternate solution to embedded memory technology for achieving tight logic and memory integration. However, with the inclusion of two or more bare dies in a common package, we inevitably alter the electrical characteristics of these integrated circuit (IC) devices. To ensure each device functions as designed, we identify several key electrical issues associated with signal transmission, power distribution system, and input/output (I/O) buffers that could potentially limit the performance of chip-on-chip modules. In addition, we provide a detailed comparison between chip-on-chip and conventional printed wiring board (PWB) implementations to demonstrate the superior electrical characteristics of these chip-on-chip modules.
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