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Tuning Electrical and Thermal Transport in AlGaN/CaN Heterostructures via Buffer Layer Engineering

机译:通过缓冲层工程调整AlGaN / CaN异质结构中的电和热输运

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摘要

Progress in wide bandgap, III-V material systems based on gallium nitride (GaN) has enabled the realization of high-power and high-frequency electronics. Since the highly conductive, 2D electron gas (2DEG) at the aluminum gallium nitride (AlGaN)/GaN interface is based on built-in polarization fields and is confined to nanoscale thicknesses, its charge carriers exhibit much higher mobilities compared to their doped counterparts. This study shows that such 2DEGs also offer the unique ability to manipulate electrical transport separately from thermal transport, through the examination of fully suspended AlGaN/GaN diaphragms of varied GaN buffer layer thickness. Notably, approximate to 100 nm thin GaN layers can considerably impede heat flow without electrical transport degradation. These achieve 4x improvement in the thermoelectric figure of merit (zT) over externally doped GaN, with state-of-the-art power factors of 4-7 mW m(-1) K-2. The remarkable tuning behavior and thermoelectric enhancement, elucidated here for the first time in a polarization-based heterostructure, are achieved because electrons are at the heterostructured interface, while phonons are within the material system. These results highlight the potential for using 2DEGs in III-V materials for on-chip thermal sensing and energy harvesting.
机译:基于氮化镓(GaN)的宽带隙III-V材料系统的进步已经实现了高功率和高频电子设备。由于氮化铝镓(AlGaN)/ GaN界面处的高导电2D电子气(2DEG)基于内置的极化场并将其限制在纳米级厚度内,因此其电荷载流子与掺杂的同行相比具有更高的迁移率。这项研究表明,这种2DEG通过检查GaN缓冲层厚度各不相同的完全悬浮的AlGaN / GaN膜片,还提供了独特的能力来控制电传输和热传输。值得注意的是,大约100 nm的GaN薄层可在不降低电传输性能的情况下极大地阻碍热流。与外部掺杂的GaN相比,这些器件的热电品质因数(zT)提高了4倍,最新功率因数为4-7 mW m(-1)K-2。由于电子在异质结构界面,而声子在材料体系内,因此在基于极化的异质结构中首次获得了卓越的调谐性能和热电增强。这些结果凸显了在III-V材料中使用2DEG进行芯片上热感测和能量收集的潜力。

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