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High speed wafer scale bulge testing for the determination of thin film mechanical properties

机译:高速晶圆级凸起测试用于确定薄膜机械性能

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摘要

A wafer scale bulge testing system has been constructed to study the mechanical properties of thin films and microstructures. The custom built test stage was coupled with a pressure regulation system and optical profilometer which gives high accuracy three-dimensional topographic images collected on the time scale of seconds. Membrane deflection measurements can be made on the wafer scale (50–150 mm) with up to nanometer-scale vertical resolution. Gauge pressures up to 689 kPa (100 psi) are controlled using an electronic regulator with and accuracy of approximately 0.344 kPa (0.05 psi). Initial testing was performed on square diaphragms 350, 550, and 1200 μm in width comprised of 720±10 nm thick low pressure chemical vapor deposited silicon nitride with ∼20 nm of e-beam evaporated aluminum. These initial experiments were focused on measuring the system limitations and used to determine what range of deflections and pressures can be accurately measured and controlled. Gauge pressures from 0 to ∼8.3 kPa (1.2 psi) were initially applied to the bottom side of the diaphragms and their deflection was subsequently measured. The overall pressure resolution of the system is good (∼350 Pa) but small fluctuations existed at pressures below 5 kPa leading to a larger standard deviation between deflection measurements. Analytical calculations and computed finite element analysis deflections closely matched those empirically measured. Using an analytical solution that relates pressure deflection data for the square diaphragms the Young’s modulus was estimated for the films assuming a Poisson’s ratio of v=0.25. Calculations to determine Young’s modulus for the smaller diaphragms proved difficult because the pressure deflection relationship remained in the linear regime over the tested pressure range. Hence, the calculations result in large error when used to estimate the Young’s modulus for the smaller membranes. The deflection measurements of three 1200×1200 μm2 Si3N4−x membranes were taken at increased pressures (>25 kPa) to increase nonlinearity and better determine Young’s modulus. This pressure-deflection data were fit to an analytical solution and Young’s modulus estimated to be 257±3 GPa, close to those previously reported in literature.
机译:已经构建了晶圆级凸起测试系统,以研究薄膜和微结构的机械性能。定制的测试台与压力调节系统和光学轮廓仪结合使用,可提供以秒为单位的时间尺度上收集的高精度三维地形图。可以在晶圆级(50–150 mm)上进行膜挠度测量,垂直分辨率最高可达纳米级。使用电子调节器可控制最高689 kPa(100 psi)的表压,其精度约为0.344 kPa(0.05 psi)。最初的测试是在方形隔膜350、550和1200μm上进行的,该隔膜由720±10 nm厚的低压化学气相沉积氮化硅和约20 nm的电子束蒸发铝组成。这些初始实验的重点是测量系统限制,并用于确定可以精确测量和控制的挠度和压力范围。首先将0至约8.3 kPa(1.2 psi)的表压施加到隔膜的底侧,然后测量其挠度。系统的整体压力分辨率良好(约350 Pa),但在低于5 kPa的压力下存在较小的波动,导致挠度测量之间的标准偏差较大。解析计算和有限元分析挠度与经验测得的挠度非常匹配。使用解析方法将方形膜片的压力挠度数据关联起来,假设泊松比为v = 0.25,可以估算薄膜的杨氏模量。确定较小隔膜的杨氏模量的计算非常困难,因为在测试压力范围内,压力挠度关系保持线性状态。因此,当用于估计较小膜的杨氏模量时,该计算会导致较大的误差。在增加的压力(> 25 kPa)下对三个1200×1200μm 2 Si3N4-x膜进行了挠度测量,以增加非线性并更好地确定杨氏模量。该压力-挠度数据适合于分析解决方案,杨氏模量估计为257±3 GPa,接近先前文献报道的那些。

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