观测了化学镀Ni/Au工艺中化学镀Ni-P镀层的状态,评估了基底化学镀Ni-P镀层的P含量和Ni析出状态对引线键合性的影响。%In this paper,electroless Ni-P plating condition in electroless Au/Ni process was observed,and influence of P content and Ni deposits condition of electroless Ni-P plating sued as under layer on wire bondability was evaluated.
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