首页> 中文期刊> 《贵金属》 >厚膜焊区Au-Pt导体浆料

厚膜焊区Au-Pt导体浆料

         

摘要

By using polyvinyl alcohol as disperse agent, Au- and Pt powders were prepared respectively by reduction of chlorauric acid to Au with ascorbic acid and reduction of chloroplatinate to Pt with hydrazine. Average size was 0.55μm for Au- and ≈0.08μm for Pt powder. One glass-, three mixed bonded pastes with Au/Pt ratio of 78/22 were formulated with oxides and borosilicates as binders. The measurement showed that the properties of a better paste were: tensile strength of >20N/mm2, shrinkage after firing of ≤0.003mm, sheet resistivity of ≤40mΩ/□/25μm, and leached amount of 0.062~0.087 mm after dipping 30 times. CuO dissolved into the glass improving chemical bond, consequently, increasing the adhesion.%用聚乙烯醇作分散剂,抗坏血酸作还原剂,将氯金酸还原到Au;以水合肼作还原剂,将氯铂酸盐还原到Pt,分别制备了Au粉和Pt粉;Au、Pt粉的平均尺寸分别为0.55μm和≈0.08μm.用氧化物和硼硅酸盐作粘结剂配制了1种玻璃粘结、3种混合粘结的浆料.浆料性能测量结果表明,一种性能较好的浆料有:拉伸强度>20N/mm2,烧结后收缩≤0.003mm,片电阻率≤40mΩ/□/25μm,30次浸锡后的溶蚀量为0.062~0.087mm.CuO溶入玻璃改善了化学键,从而提高了附着力.

著录项

相似文献

  • 中文文献
  • 外文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号