低温共烧陶瓷(LTCC)烧结收缩率的控制

摘要

LTCC(Low Temperature co-fired Ceramic)即低温共烧陶瓷技术,是近年来兴起的一种令人瞩目的多学科交叉的整合组件技术,因其优异的电子、机械、热力特性已成为未来电子元件集成化、模组化的首选方式.LTCC基板材料研究的一个热点问题就是LTCC基板材料与异质材料共烧匹配性问题.一般LTCC材料的收缩率大约为12%~16%,在应用于高性能系统时,必须严格控制其收缩行为,获得在X-Y方向零收缩率的材料.通过介绍LTCC技术在零收缩基板及内埋置材料方面的技术的研究,评估各种加工方法对LTCC收缩率的控制程度,为基板制备方法的选择提供参考.%LTCC (Low Temperature co-fired Ceramic) is the low temperature co-firing ceramic technology, is a kind of remarkable in recent years the rise of the integration of multidisciplinary cross component technology, because of their excellent electronic, mechanical, thermal properties has become the future electronic component integration, the preferred way of modularization. LTCC substrate materials research is a hot issue ofLTCC substrate materials burn matching problem with heterogeneous materials. General, LTCCmaterial shrinkage is about 12%~16%,when applied to high performance system,it is nec-essary to strictly control the shrinkage behavior, material with zero shrinkage in the X-Y direction.By in-troducing LTCC technology contract in zero base board and embedded within the material method tech-nology research, assess the degree of various processing methods of LTCC shrinkage rate control ,provide reference for the choice of substrate preparation methods.