随机振动载荷下混装组件焊点的可靠性分析

摘要

In this paper ,the modeling and simulation of mixed components are introduced .A solder and pin is transformed into a block during the modeling of the mixed components .The vibration test conditions recommended by GJB 150 .16-86 which is called EighthClassRandomVibration- JetAircraftVibrationEnvironmentisemployedtoperformrandomvibrationsimulationanalysis . The warping degree ,the region of stress concentration (weak link) ,the solder stress and strain distribution and risk solder joint po-sition of the component are analyzed .T he submodel method is used to build detailed modeling of risk zone solders and solve stress and strain values of three different types of solders .Finally ,the serive life of solders is estimated through Miner fatigue cumulative damage theory ,three band technology and three parameters S-N curve approximation formula .The results obtained from the analy-sis as following :wing pin solder’s vibration strength is the lowest and the value is 8 .54 h ,the J solder’s fatigue life is 8 .96 h ,and the BGA solder’s fatigue life is 14 .18 h .%选取混装组件进行建模仿真，建模时将混装组件中焊点和引脚等效成一个块状进行简化处理。采用GJB150.16-86中推荐的“第8类随机振动-喷气式飞机振动环境”振动试验条件进行随机振动仿真分析，分析组件的翘曲度、组件应力集中区域（薄弱环节）、组件中器件焊点应力应变分布及危险焊点位置；再运用子模型法建立危险区域焊点精细模型，利用子模型来求解3种不同类型焊点的应力应变值；最后运用M iner疲劳累积损伤理论、三带技术和三参数 S- N曲线近似公式进行不同类型焊点寿命估算。研究结果表明：翼形引脚焊点类型抗振强度最低， J型引脚焊点类型其次， BGA类鼓状焊点类型抗振强度最好；BGA类鼓状焊点振动疲劳寿命为14.18 h ，翼形焊点疲劳寿命为8.54 h ， J形焊点疲劳寿命为8.96 h。