基于失效物理的电路板寿命预测案例研究

摘要

An efficient prognostics technique based on physics-of-failure is proposed to predict life of printed circuit board (PCB) in the ship-borne electronic products. By the case study of a PCB in typical ship-borne electronic products, the life prediction process of ship-borne PCB is presented. The typical life cycle environmental profile of the PCB is formed by considering three weak parts and the working environment of the PCB. After loading the environmental profile, the PCB life with its variation is obtained by the finite element analysis on temperature distribution and structural dynamic. In addition, two influencing factors Lair and RH from electromagnetic relays on the PCB life are analyzed in the models.%舰载电子产品中电路板运用有效的寿命预测技术，可满足舰载武器寿命周期内的特定需求，从而提高其贮存期内维修保障的效率。依照基于失效物理的寿命预测流程，以典型舰载电子产品中的某个电路板为案例，拟定出3个薄弱环节，并参考该电子产品的实际应用情况，经剪裁后得到了其典型寿命周期环境载荷剖面且加载该剖面；同时对电路板温度分布、结构动力振动进行了有限元仿真计算，得出了该电路板上薄弱环节的寿命及其变化范围，从而预测出该电路板的寿命为3.25年；最后进一步分析了模型中电磁继电器对于空气的等效标准漏率以及应用环境中相对湿度对寿命的影响。