首页> 外国专利> LIFE ESTIMATION METHOD OF PRINTED WIRING BOARD, PRINTED WIRING BOARD AND LIFE ESTIMATION DEVICE OF PRINTED WIRING BOARD

LIFE ESTIMATION METHOD OF PRINTED WIRING BOARD, PRINTED WIRING BOARD AND LIFE ESTIMATION DEVICE OF PRINTED WIRING BOARD

机译:寿命预测印刷电路板,印刷电路板及印刷电路板的寿命估计装置,

摘要

PROBLEM TO BE SOLVED: To estimate the life of a printed wiring board by measuring migration generated between electric wirings of a printed wiring board quantatively without having to a device wherein a circuit board is incorporated. ;SOLUTION: Measurement conductors 15, 16 are wired adjacent to an electronic circuit 14 on a board 12 by a print means. The measurement conductors 15, 16 are formed of a metal which generates migration more easily than an electric wiring 13 and a pair of comb-like electrodes 17, 18 which face each other are constituted in a counter terminal side. When a voltage is applied to a terminal 13a of the electric wiring 13, a voltage is also applied between the measurement conductor 15, 16 synchronously with the voltage application. Therefore, generation of migration of the measurement conductors 15, 16 can be checked by measuring a resistance between the measurement conductors 15, 16, thus enabling generation of migration (life) of the electric wiring 13 to be estimated.;COPYRIGHT: (C)1997,JPO
机译:解决的问题:通过定量地测量印刷线路板的电气配线之间产生的迁移来估计印刷线路板的寿命,而无需安装有电路板的装置。解决方案:测量导体15、16通过印刷装置与电路板12上的电子电路14相邻布线。测量导体15、16由比电气配线13更容易发生迁移的金属形成,并且在对置端子侧构成彼此相对的一对梳状电极17、18。当将电压施加到电线13的端子13a时,电压也与施加电压同步地施加在测量导体15、16之间。因此,可以通过测量测量导体15、16之间的电阻来检查测量导体15、16的迁移的产生,从而使得能够估计电线13的迁移(寿命)的产生。版权:(C) 1997年

著录项

  • 公开/公告号JPH0946010A

    专利类型

  • 公开/公告日1997-02-14

    原文格式PDF

  • 申请/专利权人 TOSHIBA CORP;

    申请/专利号JP19950193921

  • 发明设计人 ITO WATARU;

    申请日1995-07-28

  • 分类号H05K1/02;

  • 国家 JP

  • 入库时间 2022-08-22 03:35:07

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