基于无损检测的高分辨率PCB板焊点缺陷检测系统

摘要

为了能快速、准确地对BGA封装器件的PCB板上的焊点进行缺陷检测,设计了高分辨率X-射线无损检测的缺陷检测系统.给出了系统的基本工作原理和硬件结构,采用等比例成像的方法求解了获得最高分辨率的距离信息.分析了系统可能存在的噪声源,并设计了去噪算法用于提高图像信噪比.试验采用HAWK-180XI型X-射线源、高速图像采集卡和UNIQ-2000型CCD相机等对BGA封装的PCB板缺陷进行检测,结果显示:系统可以快速有效地获得被测PCB板的图像信息,并给出缺陷的位置、尺寸等特征信息,满足设计要求.%In order to be able to solder defect detection quickly and accurately for BGA package devices on the PCB,this paper designed a high-resolution defect detection system by X-ray non-destructive detection.The basic working principle and hardware structure of the system was given,using equal ratio imaging methods to solve to obtain the distance information of the highest resolution.It analyzed the noise source from the system and designed algorithm for removing noise,which was used to improve the image signal-to-noise ratio.In experiment,it adopted the HAWK-180XI type X-ray source,a high-speed image capture card and UNIQ-2000 type CCD camera,and detected PCB board defects with BGA package.Experimental results show that the system can quickly efficiently obtain image information for the PCB board,and obtain the defects information for location,size and other characteristics.The system can meet the design requirements.