在图像传感器和存储产品中应用硅通孔工艺的300 mm光刻与键合技术

摘要

Technology advances such as 3-D Integration are expanding the potential applications of products into mass markets such as consumer electronics.还需要涂胶,形成图形和刻蚀图形结构.研究了一些用于三维封装的光刻和晶圆键合技术问题并将叙述全部的挑战和适用的解决方案.技术方面的处理结果将通过晶圆键合和光刻工序一起讨论.