CMOS IMAGE SENSOR BIG VIA BONDING PAD APPLICATION FOR AlCu PROCESS

摘要

PPROBLEM TO BE SOLVED: To provide a CMOS image sensor big via bonding pad application for AlCu process. PSOLUTION: An integrated circuit includes a substrate having a bonding pad region and a non-bonding pad region. A relatively large via, called a "big via", is formed on the substrate in the bonding region. The big via has a first dimension in a top view toward the substrate. The integrated circuit also has a plurality of vias formed on the substrate in the non-bonding region. The plurality of vias each have a second dimension in the top view and the second dimension is considerably smaller than the first dimension. PCOPYRIGHT: (C)2011,JPO&INPIT