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Application of large via bonding pad of AlCu process CMOS image sensor
Application of large via bonding pad of AlCu process CMOS image sensor
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机译:AlCu工艺CMOS图像传感器大通孔焊盘的应用
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摘要
An integrated circuit includes a substrate having a bonding pad region and a non-bonding pad region. A relatively large via, called a "big via," is formed on the substrate in the bonding region. The big via has a first dimension in a top view toward the substrate. The integrated circuit also includes a plurality of vias formed on the substrate in the non-bonding region. The plurality of vias each have a second dimension in the top view, the second dimension being substantially less than the first dimension.
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