利用电化学沉积法制备以纳米SiO2微粒为增强相的Cu-纳米SiO2复合镀层.研究发现:Cu-纳米SiO2复合镀层的形貌特征不同于纯铜镀层的,其性能较好.增强相纳米SiO2微粒引起形核增殖、结晶细化,同时形成弥散强化,致使Cu-纳米SiO2复合镀层的形貌特征不同,性能得以改善.随着镀液中纳米SiO2微粒的质量浓度的增加,Cu-纳米SiO2复合镀层的显微硬度先升高后降低,体积磨损率先减小后增大.当镀液中纳米SiO2微粒的质量浓度为35 g/L时,Cu-纳米SiO2复合镀层的显微硬度最高,接近1 500 MPa,约为纯铜镀层的1.46倍;体积磨损率最低,为6.59×10-5 mm3/(N· m),比纯铜镀层的降低约35.4％.%Cu-nano SiO2 composite coating,in which nano SiO2 particle was used as reinforced phase,was prepared by electrochemical deposition.Research showed that,compared with pure copper coating,the morphology characteristics of Cu-nano SiO2 composite coating were different,and the properties of Cu-nano SiO2 composite coating were better.It was considered that nano SiO2 particle causes nucleation growth,which result in grain refinement strengthening and dispersion strengthening.As the mass concentration of nano SiO2 particle in plating solution increase,the microhardness of Cu-nano SiO2 composite coating increase first and then decrease,while the volume abrasion rate of Cu-nano SiO2 composite coating decrease first and then increase.When the mass concentration of nano SiO2 particle was 35 g/L,the Cu-nano SiO2 composite coating prepared with the highest microhardness being approximately 1 500 MPa,which was about 1.46 times of that of pure copper coating.And furthermore,the Cu-nano SiO2 composite coating prepared with the lowest volume abrasion rate of about 6.59 × 10 5 mm3/ (N·m),which was reduced by 35.4％ compared with pure copper coating.
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