芯片背金属剥离分析

摘要

封装制程中发生金属层剥离对产品可靠性产生致命伤害[1].背金属制程污染是产生剥离的主要原因，封装制程使用的材料和工艺对金属剥离的程度有影响.EDX电子显微镜分析有助于确认金属剥离界面的物质元素，通过比对背面金属设计可以确定剥离是在金属镀膜过程还是封装过程中产生.蒸金过程提高清洗质量和防止化剂交叉污染，封装过程降低胶带粘性、使用胶木/集束顶针、降低热烘温度和时间、降低顶出高度和速度等可减少背面金属膜剥离.%　　Metal film peeling on product during assembly process cause serious reliability issue. Chip backside pollution is the main reason for the metal film peeling. Assembly materials used in and process to the extent of the metal film peeling have an impact. EDX electron microscope analysis to identify metal film peeling interface material elements, by comparing the back metal design can determine the peeling is occurred in the metal coating process or assembly process. Steamed metal film process improve the cleaning quality and prevent catalyst cross contamination, assembly process reduce the tape adhesiveness, use bakelite/cluster needle, reduce heat drying temperature and time, reduce the ejection height and speed well reduce the metal film peeling .