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Chip pickup device and chip pickup method and chip peeling apparatus and chip peeling method

机译:芯片拾取装置和芯片拾取方法以及芯片剥离装置和芯片剥离方法

摘要

PROBLEM TO BE SOLVED: To provide a chip pickup device capable of picking up a chip at a high velocity as well as a chip pickup method, and a chip peeling device as well as a chip peeling method.;SOLUTION: The chip pickup device vacuum-holds and picks up a chip 6 pasted on a sheet 5 by using a takeout nozzle 20. A sheet lifting member 24 is formed from a flexible elastic body, such as rubber, into a sphere, and is set in a recess 22c prepared in an upper contact support surface of a peeling tool 22. The lift-up face of the sheet lifting member 24 is made to contact the underside of the sheet 5 at a right angle, according to a planar state, when the takeout nozzle 20 is in a down state. The lower surface of the sheet 5 is lifted while the lift-up face is deformed into an upward convex curved surface shape when the takeout nozzle 20 rises together with the chip 6. By so doing, the sheet 5 and the chip 6 can be separated from the chip's outer edge side.;COPYRIGHT: (C)2007,JPO&INPIT
机译:要解决的问题:提供一种能够高速拾取芯片的芯片拾取装置以及一种芯片拾取方法,一种芯片剥离装置以及一种芯片剥离方法。 -通过使用取出喷嘴20保持并拾取粘贴在片材5上的芯片6。片材提升构件24由诸如橡胶的柔性弹性体形成为球形,并且被放置在制备成的凹部22c中。当取出喷嘴20处于打开状态时,根据平面状态,使片材提升构件24的提升面与片材5的下侧成直角接触,从而使剥离工具22的上接触支撑表面。处于下降状态。当取出喷嘴20与切屑6一起上升时,片材5的下表面被抬起,而提升面变形为向上的凸曲面形状。这样,片材5和切屑6可以分离。版权:(C)2007,JPO&INPIT

著录项

  • 公开/公告号JP4462183B2

    专利类型

  • 公开/公告日2010-05-12

    原文格式PDF

  • 申请/专利权人 パナソニック株式会社;

    申请/专利号JP20050371464

  • 发明设计人 笠井 輝明;

    申请日2005-12-26

  • 分类号H01L21/67;

  • 国家 JP

  • 入库时间 2022-08-21 19:00:59

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