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Chip pickup device and chip pickup method and chip peeling apparatus and chip peeling method

机译:芯片拾取装置和芯片拾取方法以及芯片剥离装置和芯片剥离方法

摘要

PROBLEM TO BE SOLVED: To provide chip pickup apparatus and method and chip peeling apparatus and method capable of picking up a chip at high speed without damaging it.;SOLUTION: In the chip pickup apparatus for picking up the chip 6 stuck on a sheet 5 by sucking and holding it using a take-out nozzle 20, a sheet push-up member 24 with spherically formed flexible elastic body such as rubber is mounted on the abutting support surface on the top face of a peeling tool 22. In the moved down state of the take-out nozzle 20, the sheet push-up surface of the sheet push-up member 24 is made to abut the underside of the sheet 5 by becoming planar following the shape of the underside. In the moving up operation wherein the take-out nozzle 20 is moved up along with the chip 6, it pushes up the underside of the sheet 5 while deforming the push-up surface into an upwardly convex shaped curved surface. Thus, the sheet 5 and the chip 6 can be peeled off from each other starting from the outer edge side of the chip.;COPYRIGHT: (C)2007,JPO&INPIT
机译:解决的问题:提供一种能够在不损坏芯片的情况下高速拾取芯片的芯片拾取设备和方法以及芯片剥离设备和方法。解决方案:在该芯片拾取设备中,用于拾取粘附在薄片5上的芯片6。通过使用取出喷嘴20抽吸并保持,将具有球形的诸如橡胶的柔性弹性体的片材上推构件24安装在剥离工具22的顶面上的邻接支撑表面上。在取出喷嘴20的状态下,通过使片材上推部件24的片材上推面与下侧的形状成为平面,使片材上推面24与片材5的下侧抵接。在使喷嘴20与切屑6一起向上移动的向上移动操作中,它使片材5的下侧向上推动,同时使上推表面变形为向上凸出的弯曲表面。因此,片材5和芯片6可以从芯片的外边缘侧开始彼此剥离。;版权所有:(C)2007,JPO&INPIT

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