高可靠器件广泛应用于航空、航天等军用领域,由于使用环境恶劣,性能和可靠性要求更高。但由于器件规定的项目(参数)往往不全,测试条件不能覆盖全部使用状态,经常引起整机质量问题。本文从测试项目、测试条件和测试方法3个方面,以实例分析了高可靠半导体器件电参数测试存在的问题,研究了提高测试覆盖性的方法。采用CMOS静态功耗电流(IDDQ)测试、主载波测试等基于故障测试方法可以提高覆盖率。%Because apply condition of high reliability devices is very bad,parameters is often incomplete;test condition for all apply is not covered in device specification。Using testing static power current(IDDQ)for CMOS devices and main carrier for defect oriented test method can increase testing coverag。 This paper, from the test project, test condition and test method three aspects to example analyzed high reliability semiconductor devices the parameters of the existing problems in the test, the test method of improving coverage.
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