Sn基无铅钎料与Cu基板间化合物Cu6Sn5的研究进展

摘要

主要介绍了Sn基无铅钎料和Cu基板在界面处反应生成的金属间化合物Cu6Sn5与焊接点可靠性的关系.综述了近年来Cu6Sn5的研究进展,内容包括:Sn基无铅钎料在Cu基板上形成的Cu6Sn5的生长形态、晶体取向、生长动力学以及纳米颗粒对界面Cu6Sn5尺寸及形貌的影响.%The relation of reliability of soldering joints and the intermetallic compound (IMC) Cu6Sn5 resulted from the interfacial reaction between Sn-based lead-free solders and Cu substrates is introduced. The research developments about Cu6Sn5 in this years are reviewed, whose contents include the growth morphology, crystal orientation, growth kinetics and the effect of nano-particles on the size and morphology of Cu6Sn5 phase formed between Sn-based solders and Cu substrates.