School of Materials Science and Engineering, Dalian University of Technology, 2 Linggong Road, Dalian 116024, China Institute of Microelectronics of Chinese Academy of Sciences, 3 Beitucheng West Road, Beijing 100029, China;
School of Materials Science and Engineering, Dalian University of Technology, 2 Linggong Road, Dalian 116024, China;
Institute of Microelectronics of Chinese Academy of Sciences, 3 Beitucheng West Road, Beijing 100029, China;
Institute of Microelectronics of Chinese Academy of Sciences, 3 Beitucheng West Road, Beijing 100029, China;
机译:SN-AG-Cu焊球中初级Cu6SN5和Ag3SN金属间质的形态学
机译:研究扩散反应界面动力学和稳定性的框架及其在Cu6Sn5金属间化合物生长中的应用
机译:Cu / Sn / Cu结构的瞬时液相反应中Cu6Sn5和Cu3Sn金属间化合物中板状通道的形成
机译:AG
机译:用于3D-IC包装的微型凸点中多孔Cu3Sn金属间化合物的形成机理
机译:温度梯度下Cu / Sn / Cu互连中液-固界面处Cu6Sn5金属间化合物的生长动力学
机译:Cu / Sn / Cu / Cu互连在温度梯度下液固界面Cu6Sn5金属间化合物的生长动力学