功率电子封装用陶瓷基板技术与应用进展

摘要

综述了功率电子封装用陶瓷基板技术及其发展趋势，重点分析了厚膜陶瓷基板（TFC）、直接键合铜陶瓷基板（DBC）和直接电镀铜陶瓷基板（DPC）的制备技术与物理特性，并对其在绝缘栅双极晶体管（IGBT）、激光器（LD）、发光二极管（LED）等领域的应用进行了论述。%Technologies and development tendency of ceramic substrates for the packaging of power electronic devices are reviewed, especially focused on the preparation and characteristics of thick film ceramic (TFC), directed bonded copper (DBC) and directed plated copper (DPC). Finally, the applications of ceramic substrate in the fields of IGBT, LD, LED packaging are analyzed.