超高速旋转金刚石划片刀制造工艺的研究

摘要

When ultra-high-speed cutting tool during the work,the quality of the tool structure and cutting parameters change will have a huge impact on the workpiece,the paper turning process silicon wafer cutting blade stroke,the plating process and follow-up process are discussed by in its ultra-high speed cutting machine for cutting experiment by changing the cutting parameters cutting speed,and cutting the workpiece after the kerf width measurements, obtained kerf width with cutting speed diagram, drawn optimized cutting parameters.%刀具在进行超高速切削工件时，刀具结构上及切削参数的变化会对工件的质量产生很大的影响。在超高速切削机床上用其进行切削实验，对切削硅晶片的划片刀的车削工艺、电镀工艺和后续加工工艺进行研究，利用改变切削参数中的走刀速度，并对切削之后的工件切缝宽度进行测量，得出切缝宽度与走刀速度关系，得出优化的切削参数。