Dicing blade, dicing method using the dicing blade, and manufacturing method of semiconductor device

摘要

The present invention relates to a dicing blade capable of suppressing chipping without lowering the transfer speed of the dicing blade at the time of dicing a semiconductor wafer using a rotary dicing blade, a dicing method using the dicing blade, And a method for producing the same. For this purpose, fullerene is used as the abrasive grains of the rotating dicing blade.