孔表面化学镀Ni-P及其沉积机制

摘要

The surface morphology and composition of Ni-P coating were analyzed by SEM and EDS. The deposition rate of Ni-P coating was measured by weight gain method. The surface morphology showed axial grains in the initial stage and cellular structure after forming continuous film. The chemical composition of cellular structure was different from that of the half sphere nuclei nucleated on it. The depositing rate decreased with the decrease of hole height when the height of through hole and blind hole was less than 1. 76 mm and 2. 2 mm respectively.%用扫描电镜(SEM)对化学镀Ni-P沉积层形貌进行观察,用能谱仪(EDS)对镀层成分进行分析,用增重法测量沉积速率.试验结果表明,化学镀初期镀层表面形貌为等轴颗粒状,形成连续膜后镀层形貌为胞状.胞状组织上形成的晶核成分与基体胞状组织成分不同.通孔和盲孔高度分别小于1.76 mm和2.2mm时,化学镀Ni-P沉积速率随孔高度的减小而下降.