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Characterization of Electroless Ni-P Deposits on Surface of AZ91D Magnesium Alloy

机译:AZ91D镁合金表面化学镀Ni-P沉积的表征

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Characterization of electroless nickel deposits on magnesium alloys was investigated by X-ray diffraction (XRD), scanning electron microscope (SEM), energy dispersive spectrometer (EDS) and electrochemical potentiodynamic polarization analysis. The result of XRD showed that the electroless nickel deposits on magnesium alloys were composed mostly of amorphous Ni-P and partially of microcrystalline nickel. The phosphorus content in the Ni-P deposits was 10.8% by the calculation of EDS. SEM micrographs showed that morphology of electroless nickel deposits on magnesium alloys was a typical cellular structure, and the growth of cellular structure was influenced by surface condition of substrate. Zinc layer between substrate and electroless nickel deposits was not found by the results of SEM and EDS, which indicated that the zinc layer on the surface of magnesium alloy was very thin, and the zinc would dissolved while being immersed in electroless nickel plating solution. The thin zinc layer was almost dissolved completely before Ni-P plating. The result of electrochemical potentiodynamic polarization analysis showed that the corrosion potential Ecort of electroless nickel deposits in 3.5%NaCl solution was about -0.53 V, which was 1 V higher than that of magnesium alloys substrate. And corrosion current density of Ni-P deposits in 3.5%NaCl solution was much smaller than that of magnesium alloys substrate at the same potential value, which indicated that corrosion resistance of electroless Ni-P deposits was excellent. Discoloration time of concentrated nitric acid test for electroless nickel deposits on magnesium alloys was 445 s, which also indicated excellent corrosion resistance.
机译:通过X射线衍射(XRD),扫描电子显微镜(SEM),能量色散谱仪(EDS)和电化学势动力极化分析研究了镁合金上化学镀镍沉积物的表征。 XRD的结果表明,镁合金上的化学镀镍沉积物主要由非晶态Ni-P组成,部分由微晶镍组成。通过EDS计算,Ni-P沉积物中的磷含量为10.8%。 SEM照片表明,镁合金上化学镀镍的形貌是典型的孔结构,而孔结构的生长受基底表面条件的影响。通过SEM和EDS的结果未发现在基板和化学镀镍之间的锌层,这表明镁合金表面的锌层非常薄,并且锌在浸入化学镀镍溶液中时会溶解。在进行Ni-P电镀之前,锌薄层几乎完全溶解。电化学电位极化分析的结果表明,在3.5%NaCl溶液中化学镀镍沉积物的腐蚀电势Ecort约为-0.53 V,比镁合金基底的腐蚀电势高1V。在相同电位值下,Ni-P沉积物在3.5%NaCl溶液中的腐蚀电流密度远小于镁合金基底,这表明化学镀Ni-P沉积物的耐蚀性极好。镁合金上化学镀镍沉积物的浓硝酸测试褪色时间为445 s,这也表明其具有出色的耐腐蚀性。

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