集成电路封装热设计的目的在于尽可能地提高封装的散热能力,确保芯片的正常运行.多芯片封装(MCP)可以提高封装的芯片密度,提高处理能力.与传统的单芯片封装相比,由于包含多个热源,多芯片封装的热管理变得更为关键.本文针对一种2维FBGA MCP产品,进行有限元建模仿真,并获得封装的热性能.通过热阻比较的方式,分析了不同的芯片厚度对封装热性能的影响.针对双芯片封装,通过对不同的芯片布局进行建模仿真,获得不同的芯片布局对封装热阻的影响.最后通过封装热阻的比较,对芯片的排列布局进行了优化.分析结果认为芯片厚度对封装热阻的影响并不明显,双芯片在基板中心呈对称排列时封装的热阻最小.%Thermal design of the IC package is to improve the thermal dissipation ability of the package. Multi chip-package (MCP) is designed to increase the density of integrated electronics and improve the processing power. Due to the multi-heat sources in a package, heat management becomes more critical for MCPs. This paper presents the finite elements simulation of FBGA MCP product. The effect of chip thickness to the thermal resistance of the package is presented. Through a comparison of the thermal performances, the chip placement is optimized. The simulation results show that chip thickness does not have a profound effect to the thermal resistance of MCPs, and the smallest thermal resistance is obtained when the two chips are symmetrically arranged in the center of the substrate.
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