针对TO-220封装的功率器件，利用ANSYS软件对其进行三维建模及模型校准，校准过程研究了有无PCB板、热源厚度及有无引线对模型准确性的影响。进而基于校准后模型，研究了粘结层面积、芯片相对于基板位置以及基板面积与散热效果的关系。分析结果表明，焊料层面积大小对散热基本没影响，芯片在粘片工艺中应尽量把芯片放置在中间往下方位置，而基板面积越大，芯片散热效果越好。%The ANSYS software is used to establish the 3D model of the TO-220 package power device and calibrate the model. The calibration process is to study the effects upon the model accuracy from the presence or ab-sence of PCB,the thickness of the heat source and the presence or absence of lead. Based on the calibrated model, the effects upon the heat dissipation from the area of the adhesive layer,the position of the chip relative to the sub-strate and the base area have been also investigated. The results show that the size of the solder layer basically has no influence on the heat dissipation,the chip die attach process should try to place the chip in the middle and down position,moreover,the larger the area of the substrate,the better the dissipation effect will be.
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