陶瓷焊球阵列封装可靠性研究与试验分析

摘要

为了研究焊球成分和焊盘尺寸对陶瓷焊球阵列封装（CBGA）可靠性的影响，本文选用3种验证板，采用共晶焊球和Sn63Pb37焊盘、高铅焊球和Pb90Sn10焊盘、共晶焊球和Pb90Sn10焊盘，分别进行可靠性试验。结果表明，采用高铅焊球和Pb90Sn10焊盘时，CBGA焊球的失效率最低，为74%。%In order to study the inlfuence of solder bump composition and solder pad dimension on the reliability of CBGA, three experimental boards were designed in this article, which were eutectic solder bumps with Sn63Pb37 pad, high-lead solder bumps with Pb90Sn10 pad and eutectic solder bumps with Pb90Sn10 pad, reliability experiments were carried on. The result shows that high-lead solder bumps with Pb90Sn10 pad will result in the lowest failure rate of CBGA solder bump, that is 74%.