低热膨胀聚酰亚胺的制备及应用

摘要

介绍了四种典型的制备低热膨胀聚酰亚胺的方法，它们是共聚物掺混、多元共聚、添加填料或其他化合物及有机硅氧烷改性。综述了低热膨胀聚酰亚胺在微电子技术、柔性印刷电路板等方面的应用。%The preparation methods of the polyimide with low coefficient ofthermal expansion were introduced. The methods are copolymers blending process, multiple copolymerization process, adding fillers process, and modification process with organo-silicone. The application of the polyimide with low coefficient of thermal expansion in micro-electronics technology, soft-printing circuit plate were summarized.