机译:具有超低热膨胀系数的耐热聚酰亚胺酰胺薄膜的制备,用于光电应用
Chinese Acad Sci, Lab Adv Polymer Mat, Inst Chem, Beijing 100190, Peoples R China|Univ Chinese Acad Sci, Sch Chem & Chem Engn, Beijing 100049, Peoples R China;
Chinese Acad Sci, Lab Adv Polymer Mat, Inst Chem, Beijing 100190, Peoples R China;
Chinese Acad Sci, Lab Adv Polymer Mat, Inst Chem, Beijing 100190, Peoples R China;
Chinese Acad Sci, Lab Adv Polymer Mat, Inst Chem, Beijing 100190, Peoples R China|Univ Chinese Acad Sci, Sch Chem & Chem Engn, Beijing 100049, Peoples R China;
Chinese Acad Sci, Lab Adv Polymer Mat, Inst Chem, Beijing 100190, Peoples R China;
Chinese Acad Sci, Lab Adv Polymer Mat, Inst Chem, Beijing 100190, Peoples R China|Univ Chinese Acad Sci, Sch Chem & Chem Engn, Beijing 100049, Peoples R China;
Poly(amide-imide)s; Films; Hydrogen bonding interactions; Heat-resistance; Thermal expansion;
机译:具有超级热膨胀系数的耐热聚(酰胺 - 酰亚胺)薄膜的耐热膨胀用于光电应用
机译:具有超低热膨胀系数的溶液可加工的无色聚酰亚胺,用于光电应用
机译:高温稳定氢键的构建,用超级热膨胀和高TG制备聚酰亚胺膜
机译:多晶硅薄膜原位热膨胀系数测量的新方法MEMS材料应用
机译:用于空间应用的低热膨胀铝合金的低热量铝合金的电气放电加工=高热扩张系数铝合金应用的电气化Usility
机译:热膨胀系数极低的固有黑色聚酰亚胺薄膜的制备和性能及其在黑色柔性覆铜箔层压板中的潜在应用
机译:具有极低热膨胀系数的固有黑色聚酰亚胺薄膜的制备与性能及黑色柔性铜包层压板的潜在应用