一种3D堆叠集成电路中间绑定测试时间优化方案

摘要

中间绑定测试能够更早地检测出3D堆叠集成电路绑定过程引入的缺陷，但导致测试时间和测试功耗剧增。考虑测试TSV、测试管脚和测试功耗等约束条件，采用整数线性规划方法在不同的堆叠布局下优化中间绑定测试时间。与仅考虑绑定后测试不同，考虑中间绑定测试时，菱形结构和倒金字塔结构比金字塔结构测试时间分别减少4畅39％和40畅72％，测试TSV增加11畅84％和52畅24％，测试管脚减少10畅87％和7畅25％。在测试功耗约束下，金字塔结构的测试时间增加10畅07％，而菱形结构和倒金字塔结构测试时间只增加4畅34％和2畅65％。实验结果表明，菱形结构和倒金字塔结构比金字塔结构更具优势。%Mid-bond test can detect the defects introduced in the bonding process earlier ,which will also result in the signifi-cant growth of the test application time and test power consumption .Considering the test TSVs ,test pins and power consumption ,In-teger Linear Programming was used to optimize the test application time under three stack structures .Different from the post bond test ,compared with the Pyramid structure ,the test application time decreases by 4.39% and 40.72% ,the number of test TSV in-creases by 11.84% and 52.24% ,the number of test pin reduces by 10.87% and 7.25% in the diamond structure and the inverted Pyramid structure respectively .Considering the test power consumption ,the test application time increases by 10.07% in the Pyra-mid structure ,while the diamond structure and the inverted Pyramid structure only increase by 4.34% and 2.65% .The experimental results show that the diamond structure and the inverted Pyramid structure have greater advantage over the Pyramid structure in the mid-bond test .