A method of forming a package-on-package (PoP) device having a carrier discard control for three-dimensionally integrated circuit (3DIC) stacking

摘要

A method of forming a package-on-package (PoP) device (10), comprising: preliminarily attaching a substrate (16) to a carrier (14); Stacking a first die (22) on the substrate, wherein at least the first die or substrate has a thermal expansion coefficient deviation from the carrier; Stacking a second die (26) on the first die; and performing a pressure anneal on the substrate (16) by means of a temper tempering lid (20) before the first and second die are stacked.