首页> 外文期刊>Applied Physicsletters >Three-dimensionally stacked flexible integrated circuit: Amorphous oxide/polymer hybrid complementary inverter using n-type a-In-Ga-Zn-O and p-type poly-(9,9-dioctylfluorene-co-bithiophene) thin-film transistors
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Three-dimensionally stacked flexible integrated circuit: Amorphous oxide/polymer hybrid complementary inverter using n-type a-In-Ga-Zn-O and p-type poly-(9,9-dioctylfluorene-co-bithiophene) thin-film transistors

机译:三维堆叠式柔性集成电路:使用n型a-In-Ga-Zn-O和p型聚(9,9-二辛基芴-co-bithiophene)薄膜晶体管的非晶氧化物/聚合物混合互补逆变器

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摘要

A three-dimensional vertically-stacked flexible integrated circuit is demonstrated based on hybrid complementary inverters made of n-type In-Ga-Zn-O (a-IGZO) amorphous oxide thin-film transistors (TFTs) and p-type poly-(9,9-dioctylfluorene-co-bithiophene) (F8T2) polymer TFTs, where all the fabrication processes were performed at temperatures ≤120 ℃. Saturation mobilities of the a-IGZO TFT and the F8T2 TFT are ~3.2 and ~1.7 × 10~(-3) cm~2 V~(-1) s~(-1), respectively, from which we chose the appropriate dimensions of the TFTs so as to obtain a good balance for the inverter operation. The maximum voltage gain is ~67, which is better than those reported for organic/oxide hybrid complementary inverters.
机译:基于由n型In-Ga-Zn-O(a-IGZO)非晶氧化物薄膜晶体管(TFT)和p型poly-(-)制成的混合互补逆变器,展示了一种三维垂直堆叠的柔性集成电路。 9,9-二辛基芴-共-联噻吩(F8T2)聚合物TFT,其中所有制造工艺均在≤120℃的温度下进行。 a-IGZO TFT和F8T2 TFT的饱和迁移率分别为〜3.2和〜1.7×10〜(-3)cm〜2 V〜(-1)s〜(-1),我们从中选择合适的尺寸TFT的宽度,以便为反相器操作获得良好的平衡。最大电压增益为〜67,优于有机/氧化物混合互补逆变器的电压增益。

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  • 来源
    《Applied Physicsletters》 |2010年第26期|P.263509.1-263509.3|共3页
  • 作者单位

    Frontier Research Center, Mail Box S2-13, Tokyo Institute of Technology, 4259, Nagatsuta, Midori-ku, Yokohama 226-8503, Japan;

    rnSEIKO-EPSON, 281 Fujimi, Fujimi-cho, Suwa 399-0293, Japan;

    rnSEIKO-EPSON, 281 Fujimi, Fujimi-cho, Suwa 399-0293, Japan;

    rnMaterials and Structures Laboratory, Mail Box R3-1, Tokyo Institute of Technology, 4259 Nagatsuta, Midori-ku, Yokohama 226-8503, Japan;

    rnDepartment of Electronics and Informatics, Ryukoku University, 1-5 Yokotani, Seta Oe-cho, Otsu, Shiga 520-2194, Japan;

    rnDepartment of Electronics and Informatics, Ryukoku University, 1-5 Yokotani, Seta Oe-cho, Otsu, Shiga 520-2194, Japan;

    rnDepartment of Electronics and Informatics, Ryukoku University, 1-5 Yokotani, Seta Oe-cho, Otsu, Shiga 520-2194, Japan;

    rnSEIKO-EPSON, 281 Fujimi, Fujimi-cho, Suwa 399-0293, Japan;

    rnFrontier Research Center, Mail Box S2-13, Tokyo Institute of Technology, 4259, Nagatsuta, Midori-ku, Yokohama 226-8503, Japan;

    rnFrontier Research Center, Mail Box S2-13, Tokyo Institute of Technology, 4259, Nagatsuta, Midori-ku, Yokohama 226-8503, Japan Materials and Structures Laboratory, Mail Box R3-1, Tokyo Institute of Technology, 4259 Nagatsuta, Midori-ku, Yokohama 226-8503, Japan;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
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  • 正文语种 eng
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  • 入库时间 2022-08-18 03:18:54

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