首页> 外文学位 >Semiconductor device simulation using hydrodynamic balance equations.
【24h】

Semiconductor device simulation using hydrodynamic balance equations.

机译:使用流体力学平衡方程的半导体器件仿真。

获取原文
获取原文并翻译 | 示例

摘要

A hydrodynamical simulation model of carrier transport in semiconductor devices based on the Lei-Ting balance equations is presented. Unlike conventional hydrodynamical models derived from moments of the Boltzmann transport equation, where collisions with impurities and phonons are represented by momentum and energy relaxation times, we represent the scattering interaction in terms of frictional forces acting on the carriers and energy loss rate of the carriers. As such, these quantities are calculated within the model itself, as functions of the carrier drift velocity and carrier temperature, along with the carrier density, which are themselves solved for self-consistently within our hydrodynamical model. In addition to the usual advantages of the hydrodynamical approach, such as its capability to deal with high-field, nonlinear, nonstationary and hot-electron effects, along with its modest computational cost, the new model incorporates electron-electron interactional effects (e.g., nonlocal, dynamical screening). Applications on a novel Si n
机译:提出了基于雷廷平衡方程的半导体器件载流子流体动力学仿真模型。与从玻尔兹曼输运方程的矩导出的传统流体力学模型不同,在该模型中,与杂质和声子的碰撞以动量和能量弛豫时间表示,我们用作用在载体上的摩擦力和载体的能量损失率来表示散射相互作用。因此,这些量是在模型本身内计算的,作为载流子漂移速度和载流子温度以及载流子密度的函数,它们本身在我们的流体力学模型中可以自洽地求解。除了流体动力学方法通常具有的优势(例如,其能够处理高场,非线性,非平稳和热电子效应的能力)以及适度的计算成本外,新模型还纳入了电子-电子相互作用效应(例如,非本地动态筛选)。在新型Si上的应用

著录项

  • 作者

    Cai, Jian.;

  • 作者单位

    Stevens Institute of Technology.;

  • 授予单位 Stevens Institute of Technology.;
  • 学科 Engineering Electronics and Electrical.;Physics Condensed Matter.
  • 学位 Ph.D.
  • 年度 1997
  • 页码 157 p.
  • 总页数 157
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号