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Selective molecular beam epitaxy of germanium on oxide-covered silicon.

机译:锗在氧化物覆盖的硅上的选择性分子束外延。

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This study demonstrates that Ge can be selectively grown on Si through openings in SiO2 nanotemplates by molecular beam epitaxy without applying selectivity-control agents. The SiO2 nanotemplates are created either by interferometric lithography or by "touchdown" process. The "touchdown" process takes advantage of the unique interaction between Ge and an ultra-thin layer of chemical SiO2. Due to the high concentration of OH groups in the chemical oxide layer, Ge readily diffuses through the oxide, segregates at the SiO2/Si interface, and creates dense nanoscale windows in the chemical oxide. Ge then selectively grows in the windows and coalesces into a high-quality relaxed Ge epilayer over the remaining SiO2. The high-quality and relaxation are attributed to three mechanisms: (1) the strain at the junction pad decays below the critical limit within 2 nm due to the nanoscale heterojunction; (2) the remaining SiO2 serves as artificially introduced 60° dislocations; and (3) the intermixing between Ge and Si at the heterojunction reduces the effective lattice mismatch.; To understand the surface phenomena governing the selectivity, we further experimentally measure the desorption activation energy (Edes = 42 +/- 3 kJ/mol) of Ge on SiO2 surface. The low Edes gives rise to a high Ge desorption flux from the SiO2 surface and a low diffusion barrier ( Edif ∼ 13 kJ/mol), which in turn leads to a long characteristic diffusion length. Based on these findings, we further demonstrate that hexagonally packed, single-crystal Ge rings can be grown at the contact region between self-assembled SiO2 spheres and chemical oxide covered Si substrates. These SiO2 spheres provide a surface diffusion path, which guides the Ge adspecies to the substrate. The Ge adspecies on SiO2 spheres undergo surface diffusion as well as desorption, and a fraction of Ge adspecies aggregate at the sphere/substrate contact region to form epitaxial rings by "touchdown" through the chemical SiO2.
机译:这项研究表明,Ge可以通过分子束外延通过SiO2纳米模板中的开口选择性地生长在Si上,而无需应用选择性控制剂。 SiO 2纳米模板通过干涉光刻或“触地”工艺产生。 “着陆”过程利用了Ge和化学SiO2超薄层之间独特的相互作用。由于化学氧化物层中的OH基团浓度很高,Ge易于扩散穿过氧化物,在SiO2 / Si界面处偏析,并在化学氧化物中形成致密的纳米级窗口。然后,Ge在窗口中选择性生长,并在剩余的SiO2上聚集成高质量的弛豫Ge外延层。高质量和松弛归因于三个机制:(1)由于纳米级异质结,结焊盘处的应变衰减到2 nm以内的临界极限以下; (2)剩余的SiO2是人为引入的60°位错; (3)在异质结处Ge和Si之间的混合减少了有效晶格失配。为了理解控制选择性的表面现象,我们进一步实验测量了SiO2表面上Ge的解吸活化能(Edes = 42 +/- 3 kJ / mol)。较低的Edes会引起SiO2表面的高Ge解吸通量和较低的扩散势垒(Edif〜13 kJ / mol),进而导致较长的特征扩散长度。基于这些发现,我们进一步证明六方堆积的单晶Ge环可以在自组装SiO2球与化学氧化物覆盖的Si衬底之间的接触区域生长。这些SiO2球提供了一个表面扩散路径,该路径将Ge原子引导到基板上。 SiO 2球上的Ge原子经历表面扩散以及解吸,一部分Ge原子通过在化学SiO 2上的“降落”作用在球体/基底接触区域聚集,形成外延环。

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