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Design and modeling of high speed global on-chip interconnects.

机译:高速全局片上互连的设计和建模。

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摘要

Interconnect has become a dominant factor in deep submicrometer (DSM) integrated circuits (ICs). With increasing levels of on-chip integration, more functional units are integrated onto a single die, such as a multi-core microprocessor and a system-on-chip. Global interconnect, which acts as a communication media among these functional units, plays an increasingly important role and can significantly limit the performance of advanced systems.; With decreasing on-chip clock periods, the timing characteristics of on-chip signals need to be determined and controlled more precisely. Accurate interconnect models are therefore critical to the IC design process. In this dissertation, two global inter connect models are presented. Closed-form expressions of the signal waveform are developed, which achieve good agreement with Spectre simulations.; During the interconnect design process, multiple design criteria are considered, such as delay, power, bandwidth, and noise. Repeaters are widely used in digital ICs to reduce interconnect delay and signal transition time with the penalty of additional power and area. A repeater insertion methodology is presented for achieving a tradeoff among different design criteria. Closed-form expressions for the number and size of the power optimal repeaters are developed.; With the scaling of CMOS technology, the requirements of different design criteria have become more stringent. It is increasingly difficult for conventional copper interconnect to satisfy these requirements. On-chip optical interconnect is shown to be a promising substitute for electrical interconnect in future advanced architectures. Critical lengths at which optical interconnect becomes advantageous are shown to be approximately one tenth of the chip edge length at the 22 nm technology node.; The focus of the IC design process in the DSM regime has shifted from logic optimization to interconnect optimization. The research presented in this dissertation provides several interconnect design and modeling methods to support this interconnect-centric design strategy.
机译:互连已成为深亚微米(DSM)集成电路(IC)的主要因素。随着片上集成水平的提高,更多的功能单元被集成到单个裸片上,例如多核微处理器和片上系统。全局互连充当这些功能单元之间的通信介质,扮演着越来越重要的角色,并且可能严重限制高级系统的性能。随着片上时钟周期的减少,需要更精确地确定和控制片上信号的时序特性。因此,准确的互连模型对于IC设计过程至关重要。本文提出了两个全局互连模型。开发了信号波形的闭式表达式,与Spectre仿真取得了很好的一致性。在互连设计过程中,要考虑多个设计标准,例如延迟,功率,带宽和噪声。中继器广泛用于数字IC中,以减少互连延迟和信号转换时间,同时增加了功率和面积。提出了一种中继器插入方法,以实现不同设计标准之间的权衡。开发了功率最佳中继器的数量和大小的闭式表达式。随着CMOS技术的扩展,不同设计标准的要求变得越来越严格。传统的铜互连很难满足这些要求。片上光互连被证明是未来先进架构中电互连的有希望的替代品。光学互连变得有利的临界长度显示为大约22 nm技术节点处芯片边缘长度的十分之一。 DSM机制中IC设计过程的重点已从逻辑优化转向互连优化。本文的研究提供了几种互连设计和建模方法,以支持这种以互连为中心的设计策略。

著录项

  • 作者

    Chen, Guoqing.;

  • 作者单位

    University of Rochester.;

  • 授予单位 University of Rochester.;
  • 学科 Engineering Electronics and Electrical.
  • 学位 Ph.D.
  • 年度 2007
  • 页码 269 p.
  • 总页数 269
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 无线电电子学、电信技术;
  • 关键词

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