首页> 外文会议>VLSI Design, Automation, and Test (VLSI-DAT), 2012 International Symposium on >New design on 2×VDD-tolerant power-rail ESD clamp circuit with low standby leakage in 65nm CMOS process
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New design on 2×VDD-tolerant power-rail ESD clamp circuit with low standby leakage in 65nm CMOS process

机译:在65nm CMOS工艺中具有低待机泄漏的2×耐VDD电源轨ESD钳位电路的新设计

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摘要

A 2×VDD-tolerant power-rail electrostatic discharge (ESD) clamp circuit with only thin gate oxide 1V devices and silicon-controlled rectifier (SCR) as main ESD clamp device has been proposed and verified in a 65nm CMOS process. The proposed power-rail ESD clamp circuit has an ultra-low standby leakage current by reducing the voltage drop across the gate oxide of the devices in the ESD detection circuit. From the measured results, the proposed design with SCR dimension of 50µm in width can achieve 6.5kV human-body-model (HBM), 300V machine-model (MM) ESD levels, and an ultra-low standby leakage current of 34.1nA at room temperature under the normal circuit operating condition with 1.8V bias.
机译:提出了一种2x耐VDD的电源轨静电放电(ESD)钳位电路,该电路仅采用薄栅氧化1V器件,而可控硅(SCR)作为主要ESD钳位器件,并在65nm CMOS工艺中得到了验证。所提出的电源导轨ESD钳位电路通过降低ESD检测电路中器件的栅极氧化物两端的电压降,具有超低的待机泄漏电流。根据测量结果,所建议的设计具有SCR尺寸为50μm的宽度,可以实现6.5kV人体模型(HBM),300V机器模型(MM)ESD等级,以及在34.1nA的超低待机泄漏电流正常电路工作条件下的室温,偏置电压为1.8V。

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