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A 5V-ONLY 16M FLASH MEMORY USING A CONTACTLESS ARRAY OF SOURCE-SIDE INJECTION CELLS

机译:使用源侧注射单元的无接触阵列的仅5V的16M闪存

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This source side injection virtual ground FLASH device is competitive with the standard NOR based FLASH devices in the high density marketplace in regards to die size, cost, reliability and speed. Eliminating the erase disturb condition and significantly limiting the program disturb issues makes this new architecture more reliable and attractive for the next generation of fast program high density FLASH memory.This technology is further enhanced because:1. It is easy to scale to smaller geometries.2. It is capable of 3.3V-only operation.3. Smaller sector sizes without a die size penalty are available.4. The array area is ideally dependent upon the minimum geometry rather than a particular parameter of the cell.5. Interface circuitry can be designed efficiently with standard twin-well CMOS processes.
机译:在芯片尺寸,成本,可靠性和速度方面,该源侧注入虚拟接地FLASH器件在高密度市场中与基于NOR的标准FLASH器件竞争。消除擦除干扰条件并极大地限制了程序干扰问题,使得这种新架构对于下一代快速程序高密度FLASH存储器更加可靠和有吸引力。该技术得到了进一步的增强:1。易于缩放到较小的几何形状2。仅能在3.3V下运行3。可以使用较小的扇区尺寸而不会增加裸片尺寸; 4。理想情况下,阵列面积取决于最小几何形状而不是单元的特定参数5。可以使用标准的双阱CMOS工艺有效地设计接口电路。

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