Medialess High Efficiency Electroplating of SMT Discrete Device Terminations

摘要

Metalized end terminations of ceramic surface mount discrete devices can be electroplated with solders or other metals with a high process efficiency and yield, and with a high degree of plating deposit thickness control without requiring the use of supplementary conductive media. This can be accomplished through the use of the cylindrical rotary cathode electroplating cell found in the RFT (rotary flow through) plating tool to generate a homogeneous fluidized bed dispersion of devices and plating electrolyte . This presentation details the mechanics of the RFT technology and describes how eliminating the need for conductive media during plating facilitates a higher degree of plating deposition process control while electroplating isolated ceramic capacitor and resistor end terminations. A more predictable mean deposit thickness and uniform coefficient of variance is achieved by continuous automated process monitoring and management of key process inputs expressed as a function of the total device metalization termination surface area.