首页> 外文期刊>IEEE Electron Device Letters >A Near Ideal Edge Termination Technique for 4500V 4H-SiC Devices: The Hybrid Junction Termination Extension
【24h】

A Near Ideal Edge Termination Technique for 4500V 4H-SiC Devices: The Hybrid Junction Termination Extension

机译:4500V 4H-SiC器件的近乎理想的边缘端接技术:混合结端接扩展

获取原文
获取原文并翻译 | 示例

摘要

This letter presents a new edge termination technique named a hybrid junction termination extension (Hybrid-JTE), which combines ring-assisted JTE and multiple floating zone JTE. Based on the parameters of the drift layer specified by the wafer vendor, the measured breakdown voltage of the fabricated p-i-n diode using the Hybrid-JTE is as high as 5450 V, which is close (~99%) of the ideal parallel plane p-n junction. Furthermore, measured breakdown voltages from randomly chosen 32 p-i-n diodes across the wafer show very tight distribution: 29 diodes provide breakdown voltages higher than 5000 V at 100 μA .
机译:这封信介绍了一种称为混合结终止扩展(Hybrid-JTE)的新边缘终止技术,该技术结合了环辅助JTE和多个浮动区域JTE。根据晶圆供应商指定的漂移层参数,使用Hybrid-JTE制作的pin二极管测得的击穿电压高达5450 V,接近理想平行平面pn结的(约99%) 。此外,从晶圆上随机选择的32个p-i-n二极管测得的击穿电压显示出非常紧密的分布:29个二极管在100μA时提供高于5000 V的击穿电压。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号