首页> 外文会议>Symposium on Gate Stack and Silicide Issues in Silicon Processing II, Apr 17-19, 2001, San Francisco, California >CoSi_2 formation using a Ti capping layer ― The influence of processing conditions on CoSi_2 nucleation
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CoSi_2 formation using a Ti capping layer ― The influence of processing conditions on CoSi_2 nucleation

机译:使用Ti覆盖层形成CoSi_2 ―工艺条件对CoSi_2成核的影响

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A reactive Ti capping layer is needed to getter oxygen contamination and to make the cobalt silicidation reaction a more robust process. However, the presence of a Ti capping layer induces two other effects (in addition to the beneficial gettering of oxygen impurities): the formation temperature of CoSi_2 is increased and the CoSi_2 layer has a strong (220) preferential orientation. Because of the current technological importance of the Ti/Co/Si system, we have made a detailed investigation of the influence of several process parameters (annealing temperature, selective etching, layer thickness) on the nucleation of CoSi_2 in the Ti/Co/Si system. Moreover, it is shown that the addition of Ni (i.e. a Ti/Co/Ni/Si or Ti/Ni/Co/Si structure) causes a decrease of the CoSi_2 nucleation temperature.
机译:需要反应性的Ti覆盖层,以吸收氧的污染并使钴硅化反应成为更可靠的过程。但是,Ti覆盖层的存在还引起了其他两个影响(除了氧杂质的有益吸收):CoSi_2的形成温度升高,并且CoSi_2层具有很强的(220)优先取向。由于Ti / Co / Si系统当前的技术重要性,我们对几种工艺参数(退火温度,选择性蚀刻,层厚)对Ti / Co / Si中CoSi_2成核的影响进行了详细研究。系统。而且,表明Ni的添加(即Ti / Co / Ni / Si或Ti / Ni / Co / Si结构)引起CoSi_2成核温度的降低。

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