首页> 外文会议>Symposium on Defect and Impurity Engineered Semiconductors and Devices III, Apr 1-5, 2002, San Francisco, California >Gettering by Overpressurized Bubbles Induced by High-Energy-He-Implantation In Silicon
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Gettering by Overpressurized Bubbles Induced by High-Energy-He-Implantation In Silicon

机译:高能氦注入硅引起的超压气泡吸收

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Silicon samples were implanted with He ions at 1.6 MeV using doses ranging from 1 x 10~(16) cm~(-2) to 1x10~(17)cm~(-2) with different fluxes (0.4μA/cm~2 - 2.0μA/cm~2) and annealed at high (1000℃) and low temperatures (800℃). The implantation induced-defect structure and their distribution in the depth of the sample were studied by cross section electron microscopy (XTEM). An unexpected consequence of the flux on the defect population and density was found solely for 2x10~(16) cm~(-2), which is the upper threshold to get nano-bubbles at such large implantation depth. Nuclear Reaction Analysis (NRA) were performed to measure the ratio of He remaining in the bubbles as a function of time and temperature anneal. Some samples were gold or nickel diffused at temperatures ranging from 870℃ to 1050℃ prior to He implantation. The gettering efficiency of the implantation-induced defects was measured by secondary ion mass spectroscopy (SIMS), after a high temperature getter annealing. SIMS profiles exhibit a shape and a width closely related to the presence of the defects (observed by XTEM) which are very efficient sinks for all kinds of metal impurities. The bubbles were found to be more efficient traps than the dislocation loops.
机译:硅样品以1.6 MeV的He离子注入,剂量范围为1 x 10〜(16)cm〜(-2)至1x10〜(17)cm〜(-2),通量不同(0.4μA/ cm〜2- 2.0μA/ cm〜2)并在高温(1000℃)和低温(800℃)下退火。通过截面电子显微镜(XTEM)研究了植入引起的缺陷结构及其在样品深度中的分布。仅在2x10〜(16)cm〜(-2)处发现了助焊剂对缺陷数量和密度的出乎意料的结果,这是在如此大的注入深度下获得纳米气泡的上限。进行了核反应分析(NRA),以测量气泡中残留的He的比例与时间和温度退火的关系。在氦气注入之前,一些样品是在870℃至1050℃的温度下扩散的金或镍。在高温吸气剂退火之后,通过二次离子质谱法(SIMS)测量注入引起的缺陷的吸气效率。 SIMS轮廓的形状和宽度与缺陷的存在(通过XTEM观察到)密切相关,缺陷对于各种金属杂质而言都是非常有效的吸收剂。发现气泡比位错环更有效。

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