首页> 外文会议>Symposium on Atomic Resolution Microscopy of Surfaces and Interfaces held December 3-5, 1996, Boston; Massachusetts,U.S.A. >Characterization of heterointerfaces in thin-film transistors by cross-sectional transmission electron microscopy
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Characterization of heterointerfaces in thin-film transistors by cross-sectional transmission electron microscopy

机译:截面透射电子显微镜表征薄膜晶体管中的异质界面

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Hydrogenated amorphous silicon thin-film transistors (a-Si:H TFTs) are now widely used as elements for active matrix liquid crystal displays. The nanometer-scale multilayered structure of a- Si:H TFTs has been characterized by cross-sectional transmission electron microscopy (TEM). The discrete layer construction of a faulty TFTs and the generation of defects during manufacturing processes have bene investigated. A combination of focused ion beam (FIB) etching and cross-sectional TEM leads to a successful failure analysis. A contamination layer with a thickness of 10-30 nm and microvoids inside multilayers are identified in faulty TFTs. An a-Si layer on silicon nitride (SiN_x) is crystallized during TEM observation. Electron energy loss spectroscopy analysis indicates that the diffusion of nitrogeninto a-Si layer causes the crystallization.
机译:氢化非晶硅薄膜晶体管(a-Si:H TFT)现在被广泛用作有源矩阵液晶显示器的元件。通过横截面透射电子显微镜(TEM)表征了a-Si:H TFT的纳米级多层结构。有缺陷的TFT的离散层结构和制造过程中缺陷的产生已得到研究。聚焦离子束(FIB)蚀刻和横截面TEM的结合可以成功进行故障分析。在有缺陷的TFT中发现了厚度为10-30 nm的污染层和多层内部的微孔。在TEM观察期间,氮化硅(SiN_x)上的a-Si层结晶。电子能量损失谱分析表明,氮扩散到非晶硅层中导致结晶。

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