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METHOD FOR A PLAN-VIEW TRANSMISSION ELECTRON MICROSCOPY SAMPLE PREPARATION TECHNIQUE FOR VIA AND CONTACT CHARACTERIZATION
METHOD FOR A PLAN-VIEW TRANSMISSION ELECTRON MICROSCOPY SAMPLE PREPARATION TECHNIQUE FOR VIA AND CONTACT CHARACTERIZATION
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机译:平面和透射特性的透射电子显微镜样品制备方法
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摘要
A method for preparing a transmission electron microscopy (TEM) sample for contact and via characterization. Specifically, one embodiment of the present invention discloses a method where an integrated circuit semiconductor chip (IC chip) is bonded to a piece of glass and attached to a sample holder. Areas of the IC chip are removed by polishing until a region surrounding a particular contact or via is exposed. The piece of glass supports the IC chip during the polishing process. The IC chip is cut using a focused ion beam to create a thin membrane suitable for TEM failure analysis. The thin membrane includes a plan-view cross-section from the particular contact or via. The cross-sectional plan-view is perpendicular to the longitudinal axis of the contact or via.
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